YES provides patented technologies and groundbreaking processes to optimize throughput, scalability, and speed.

YES-CV100PZ

The YES EcoCoat® system provides excellent control of the process environment by combining the latest advances in chemical vapor deposition technologies with YES plasma cleaning. This minimizes chemical usage while achieving a consistent substrate surface. It also creates the flexibility to use a wide range of organosilanes in small sample sizes to help significantly improve the cost-effectiveness for research applications requiring precise surface modification. When ready to scale to high-volume production, transition seamlessly up to the high-volume production UltraCoat system.

EcoCoat

EcoClean is a high throughput, low-cost of ownership, single-wafer photoresist removal system designed by Yield Engineering Systems (YES). The system uses an ICP remote source to generate atomic oxygen, which chemically reacts with the photoresist on the wafer surface. By employing a downstream resist strip process, EcoClean achieves a high removal rate without causing any electrical damage or defects to the substrates and devices. Additionally, EcoClean offers automated processing with low gas usage and is an eco-friendly “green” solution. This makes it an ideal choice for those looking for an efficient and environmentally responsible way to remove photoresist from wafers.

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