Description
Seller states it was never used in productionConfiguration
The uGmni-200E is a Dry Etching System manufactured by ULVAC, Inc., primarily intended for semiconductor production and experiments. It employs an Inductively Super Magnetron (ISM) plasma source and is a cluster-type system.The system is compatible with wafers up to 8 inches in diameter (including 4 and 6-inch). Its structure includes a Transfer Chamber (L0), Cassette Chamber (L1) with SMIF loader, Aligner (L2), and the main Etching Chamber (L3).The L3 Etching Chamber features a Turbo Molecular Pump (TMP) exhaust, optional Electrostatic Chuck (ESC), and sophisticated wafer temperature control via a chiller and Helium (He) gas assistance. Performance specifications guarantee an etching uniformity of $\pm 5\%$ or lower (within wafer) for continuous 8-inch $\text{SiO}_2/\text{Si}$ wafer processing. The system also supports the SECS/GEM communication interfaceOEM Model Description
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Verified
CATEGORY
Etch/Asher
Last Verified: 6 days ago
Key Item Details
Condition:
New
Operational Status:
Deinstalled / Uncrated
Product ID:
137506
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ULVAC
uGmni-200E
CATEGORY
Etch/Asher
Last Verified: 6 days ago
Key Item Details
Condition:
New
Operational Status:
Deinstalled / Uncrated
Product ID:
137506
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available