ASM is a supplier of semiconductor process equipment for wafer processing, including lithography, deposition, ion implant and single-wafer epitaxy. ASM is part of the ASM International NV group that also includes ASM Pacific Technology (ASMPT). ASMPT, in which ASMI holds a substantial ownership is a leading supplier of semiconductor process equipment for wafer assembly and packaging, and for surface mount technology.



The ASM Epsilon One is a single-wafer, lamp-heated, RTCVD (Rapid Thermal Chemical Vapor Deposition) reactor. The temperature distribution for an ASM Epsilon One CVD reactor has been simulated by commercial fluent software with the total pressure at ATM. To simplify the simulation, hydrogen is considered to be the main gas flowing over the susceptor. Additionally, Epsilon One features the industry’s highest deposition rates at low temperatures due to its optimized performance with ASM’s Silcore® precursors.

EPSILON ONE

Silicon carbide (SiC) tool uses an epitaxy process to deposit the SiC materials on either bare wafers or as part of the transistor device fabrication process.

PE208

Intrepid XP

Silicon carbide (SiC) tools use an epitaxy process to deposit the SiC materials on either bare wafers or as part of the transistor device fabrication process. Epitaxial reactors for SiC and silicon.

PE106A

Epsilon Two is a single-wafer epitaxy tool that offers a wide variety of epitaxy applications for 150mm and 200mm wafers. They range from high-temperature silicon for wafer preparation to low-temperature selective or non-selective silicon germanium (SiGe) for forming transistor strain layers.

EPSILON TWO

EPSILON E3220

Silicon carbide (SiC) tools use an epitaxy process to deposit the SiC materials on either bare wafers or as part of the transistor device fabrication process.

PE108

Intrepid ES is a 300mm epitaxy tool using our XP platform, and is designed for depositing critical transistor strain and channel layers. Processes include silicon (Si), silicon-germanium (SiGe), silicon-carbon (SiC), and other silicon-based compounds. Up to four Intrepid process modules can be configured on an Intrepid ES system.

Intrepid ES

The ASM EPSILON E2500 is a wafer epitaxy system manufactured by ASM International NV (formerly ASM Pacific Technology). It is designed for the deposition of epitaxial layers on semiconductor wafers, which is a critical process in the manufacturing of advanced semiconductor devices.

EPSILON E2500

The ASM Epsilon E2000 is a single-wafer epitaxy tool designed to accommodate various epitaxy applications. It covers a wide range of processes, including high-temperature silicon for wafer preparation and low-temperature selective or non-selective Silicon Germanium (SiGe) for creating transistor strain layers. The system is optimized for processing 150mm and 200mm wafers, offering flexibility and precision in epitaxial growth processes.

EPSILON E2000

The Epsilon 2000 PLUS is used for processing 150mm and 200mm wafers.

Epsilon E2000 PLUS

The ASM EPSILON E3200 is a high-speed, advanced packaging system manufactured by ASM. Designed for precision die attach and advanced packaging processes in the semiconductor industry. 

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

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Top ASM Epitaxial deposition (EPI)

Intrepid ES

PE108

EPSILON ONE

EPSILON E2500

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All ASM Epitaxial deposition (EPI)