Description
No descriptionConfiguration
B/IOEM Model Description
High-Power Burn-In System For 150-Watt VLSI Devices Micro Control Company announces its new HPB-2 high-power burn-in system. The HPB-2 was designed to meet the challenge of wide variations in heat dissipation and the diverse burn-in needs created by high-power VLSI devices of up to 150 watts. The HPB-2 provides precise, individual temperature control for each device under test while supporting a wide range of test strategies. Features -Burn-in and test up to 150-watt VLSI devices -Individual device under test temperature control to within ±3˚ C -128 I/O channels per driver/receiver -Programmable temperature control from 50˚ C to 150˚ C -ASIC architecture for per-pin timing, testing, and formatting -Timing on the fly, programmable edges and rep-rate with 10-nanosecond -resolution -8 vector formats per pin per cycle -Up to 50 amps of programmable power to the device under test -Clock rate of 2 to 400 MHz, programmableDocuments
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MICRO CONTROL COMPANY / MCC
HPB-2
Verified
CATEGORY
Electronic Test
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
102916
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
MICRO CONTROL COMPANY / MCC
HPB-2
CATEGORY
Electronic Test
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
102916
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
B/IOEM Model Description
High-Power Burn-In System For 150-Watt VLSI Devices Micro Control Company announces its new HPB-2 high-power burn-in system. The HPB-2 was designed to meet the challenge of wide variations in heat dissipation and the diverse burn-in needs created by high-power VLSI devices of up to 150 watts. The HPB-2 provides precise, individual temperature control for each device under test while supporting a wide range of test strategies. Features -Burn-in and test up to 150-watt VLSI devices -Individual device under test temperature control to within ±3˚ C -128 I/O channels per driver/receiver -Programmable temperature control from 50˚ C to 150˚ C -ASIC architecture for per-pin timing, testing, and formatting -Timing on the fly, programmable edges and rep-rate with 10-nanosecond -resolution -8 vector formats per pin per cycle -Up to 50 amps of programmable power to the device under test -Clock rate of 2 to 400 MHz, programmableDocuments
No documents