Description
METAL (CU)Configuration
Cu process, FI (Brooks L/P X3, brooks robot, controller, aligner), Backend, chase PC, Front PC, NCT, DUCT X3, Parts boxOEM Model Description
The SABRE Extreme, an advanced Electrofill system that has been qualified at 45 nanometers and has demonstrated fill at 32 nanometers. The SABRE Extreme incorporates a number of technological innovations for advanced manufacturing applications, including advanced wafer entry control for thin seed layers (< 200A), tunable profile control for improved uniformities, and the capability to plate on non-copper seed materials.Documents
No documents
LAM RESEARCH / NOVELLUS
SABRE EXTREME
Verified
CATEGORY
Electro Plating
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
95976
Wafer Sizes:
12"/300mm
Vintage:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / NOVELLUS
SABRE EXTREME
CATEGORY
Electro Plating
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
95976
Wafer Sizes:
12"/300mm
Vintage:
2008
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
METAL (CU)Configuration
Cu process, FI (Brooks L/P X3, brooks robot, controller, aligner), Backend, chase PC, Front PC, NCT, DUCT X3, Parts boxOEM Model Description
The SABRE Extreme, an advanced Electrofill system that has been qualified at 45 nanometers and has demonstrated fill at 32 nanometers. The SABRE Extreme incorporates a number of technological innovations for advanced manufacturing applications, including advanced wafer entry control for thin seed layers (< 200A), tunable profile control for improved uniformities, and the capability to plate on non-copper seed materials.Documents
No documents