Description
Cassette-to-cassette wafer handling capability.Configuration
ULVAC NLD-6000 ICP Plasma Etcher, purchased new in 2010 for over $1.5M. This advanced plasma etching system was lightly used and professionally maintained by ULVAC service until it was recently decommissioned. The tool is plumbed for CF4, C3F8, C4F8, N2, O2, and Ar gases. Key features include ULVAC's proprietary Neutral Loop Discharge (NLD) plasma technology that tailors the plasma field with very high plasma energy. This enables precise plasma etching of virtually any material. Our experience includes etching challenging substrates like quartz and silicon carbide (SiC). Unlike cyclical passivation systems, the NLD-6000 provides continuous passivation, delivering deep etch capability and high aspect ratios. Typical etches achieve hundreds of microns depth in SiC with aspect ratios exceeding 5:1. This production-grade system features cassette-to-cassette wafer handling, designed for high throughput and reliability in demanding fabrication environments. An exceptional tool for deep, high-precision plasma etching across diverse materials in advanced semiconductor and MEMS manufacturing. Contact for more details and pricing.OEM Model Description
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ULVAC
NLD-6000
CATEGORY
Dry / Plasma Etch
Last Verified: 29 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
136702
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Cassette-to-cassette wafer handling capability.Configuration
ULVAC NLD-6000 ICP Plasma Etcher, purchased new in 2010 for over $1.5M. This advanced plasma etching system was lightly used and professionally maintained by ULVAC service until it was recently decommissioned. The tool is plumbed for CF4, C3F8, C4F8, N2, O2, and Ar gases. Key features include ULVAC's proprietary Neutral Loop Discharge (NLD) plasma technology that tailors the plasma field with very high plasma energy. This enables precise plasma etching of virtually any material. Our experience includes etching challenging substrates like quartz and silicon carbide (SiC). Unlike cyclical passivation systems, the NLD-6000 provides continuous passivation, delivering deep etch capability and high aspect ratios. Typical etches achieve hundreds of microns depth in SiC with aspect ratios exceeding 5:1. This production-grade system features cassette-to-cassette wafer handling, designed for high throughput and reliability in demanding fabrication environments. An exceptional tool for deep, high-precision plasma etching across diverse materials in advanced semiconductor and MEMS manufacturing. Contact for more details and pricing.OEM Model Description
None ProvidedDocuments
No documents