Overview

The UNITY® is a plasma etch system that delivers world-class process results on a wide range of applications, including HARC, Dual Damascene, low-k dielectrics, poly gate, and shallow trench etch. It is designed to achieve excellent cost performance for the 130nm design rule and future technology generations. The UNITY® has various platforms, including the IIe, M, and Me, each designed to achieve higher productivity and reliability for specific applications. The UNITY® M model features high throughput, a compact design, and lower CoO (Cost of Ownership), as well as ease of maintenance. The UNITY® Me model includes a Flow Control System. The UNITY® IIe is available in 84, 85, and 88 models and features PE (IIe), IEM (IIe), DRM, and SCCM™ chambers.