Overview

The Unity II is an etch system developed by TEL, which is part of their 200mm UNITY® series. The series is known for its reliability and has been improved upon with the development of the UNITY® II, the UNITY® IIe, and most recently the UNITY® M(e). The system provides a reliable platform for various chambers and utilizes two plasma sources: DRM (Dipole Ring Magnet), which is a MERIE source, and SCCM (Super Capacitively Coupled Module), which applies to dual high-frequency plasma sources. The DRM has been successful in Dielectric and Silicon Deep Trench etch applications, while the SCCM provides controlled plasma dissociation and independent control of plasma bias. The UNITY® series achieves excellent process performance for the 130 nm design rule and later generations, while also offering optimal productivity and reliability. It is based on ongoing refinements to a proven platform.