UltraTrimmer 30
Category
Dry / Plasma EtchOverview
Gas Cluster Ion Beam system TEL’s UltraTrimmer series provides precise control of film thickness by reducing surface roughness. Cutting edge technology enables industry leading performance: sub-nanometer thickness control, a wide range of dynamic correction and high-throughput processing. UltraTrimmer series realizes a variety of custom process profiles for silicon or compound substrate and contributes to yield improvement and performance enhancement.
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