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Description
No descriptionConfiguration
Advanced Silicon Etcher (ASE) Version 2 Deep High-Aspect Ration Etcher (DRIE) Silicon etcher Load-lock and chucks for 100mm and 150mm Electrostatic clamping chuck upgrade for SOI wafers and the Xenon Difluoride (XeF) module for isotropic etching.OEM Model Description
Deep Reactive Ion Etching (DRIE)Documents
No documents
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
97582
Wafer Sizes:
4"/100mm, 6"/150mm
Vintage:
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
STS
MESC MULTIPLEX ICP
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
97582
Wafer Sizes:
4"/100mm, 6"/150mm
Vintage:
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Advanced Silicon Etcher (ASE) Version 2 Deep High-Aspect Ration Etcher (DRIE) Silicon etcher Load-lock and chucks for 100mm and 150mm Electrostatic clamping chuck upgrade for SOI wafers and the Xenon Difluoride (XeF) module for isotropic etching.OEM Model Description
Deep Reactive Ion Etching (DRIE)Documents
No documents