Description
Cassette Loading RIE Plasma Etching System Cassette-to-Cassette Automatic Operation Dual cassette configuration Double-arm atmospheric transfer robot Atmospheric High-Speed Transfer System No conventional load lock required Higher throughput and reduced cycle time Up to 8-inch (200 mm) Wafer Capability Fully Automated PLC Control Touch panel operation Recipe storage, process control, and data logging High-Precision CCP RIE Technology Excellent uniformity and process stability Typical Applications High-precision etching of: Silicon (Si) Polysilicon (Poly-Si) Silicon Dioxide (SiO₂) Silicon Nitride (SiN) Photoresist ashing, stripping, and descum Removal of organic contaminants Ideal for: Semiconductor fabs University cleanrooms R&D and pilot production linesConfiguration
No ConfigurationOEM Model Description
None ProvidedDocuments
No documents
SAMCO
200C
CATEGORY
Dry / Plasma Etch
Last Verified: 7 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
138665
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Cassette Loading RIE Plasma Etching System Cassette-to-Cassette Automatic Operation Dual cassette configuration Double-arm atmospheric transfer robot Atmospheric High-Speed Transfer System No conventional load lock required Higher throughput and reduced cycle time Up to 8-inch (200 mm) Wafer Capability Fully Automated PLC Control Touch panel operation Recipe storage, process control, and data logging High-Precision CCP RIE Technology Excellent uniformity and process stability Typical Applications High-precision etching of: Silicon (Si) Polysilicon (Poly-Si) Silicon Dioxide (SiO₂) Silicon Nitride (SiN) Photoresist ashing, stripping, and descum Removal of organic contaminants Ideal for: Semiconductor fabs University cleanrooms R&D and pilot production linesConfiguration
No ConfigurationOEM Model Description
None ProvidedDocuments
No documents