Description
ICP systemConfiguration
No ConfigurationOEM Model Description
Plasma Source: ICP Plasma Process Gas: 2Lines (standard) *Maximum 6 Lines (e.g. Chlorinated Gas, Fluoride Gas, Ar, O2, He ) Applicable Wafer: ø100 mm wafer with orientation flat (standard) *Option : ø50 mm, ø75 mm, ø50 mm (with O.F.) Wafer Material: Silicon (standard) *Option : Quartz, GaAs, Sapphire Machine Dimensions / Weight*1: W 1170 mm × D 2650 mm, H 2100 mm / 1900 kg (Main body only) Power Source*2: Single phase AC 200V, 6 kVA and Three-phase AC 200V, 15 kVA (Main body only) Dry Air: 0.49 M Pa to 0.54 M Pa, 40 L / min [A.N.R.] N 2Source: 0.5 M Pa to 0.7 M Pa, 50 L / minDocuments
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PANASONIC
E600L
CATEGORY
Dry / Plasma Etch
Last Verified: 8 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
114506
Wafer Sizes:
12"/300mm
Vintage:
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
ICP systemConfiguration
No ConfigurationOEM Model Description
Plasma Source: ICP Plasma Process Gas: 2Lines (standard) *Maximum 6 Lines (e.g. Chlorinated Gas, Fluoride Gas, Ar, O2, He ) Applicable Wafer: ø100 mm wafer with orientation flat (standard) *Option : ø50 mm, ø75 mm, ø50 mm (with O.F.) Wafer Material: Silicon (standard) *Option : Quartz, GaAs, Sapphire Machine Dimensions / Weight*1: W 1170 mm × D 2650 mm, H 2100 mm / 1900 kg (Main body only) Power Source*2: Single phase AC 200V, 6 kVA and Three-phase AC 200V, 15 kVA (Main body only) Dry Air: 0.49 M Pa to 0.54 M Pa, 40 L / min [A.N.R.] N 2Source: 0.5 M Pa to 0.7 M Pa, 50 L / minDocuments
No documents