A global micro-fabrication equipment company serving customers in the semiconductor industry and adjacent high-tech sectors.

The Primo D-RIE® system, AMEC’s first-generation dielectric etch product, is a 300mm cluster tool that can be configured with up to three dual-station process modules (PM). Each PM allows two wafers to be processed simultaneously while in a single wafer processing environment. The product utilizes AMEC’s proprietary decoupled VHF and LF RF system plasma source, FEIS ring plasma confinement, and advanced kits to control the processing chamber environment. The Primo D-RIE system was designed for etch applications for all dielectric film stacks, including Silicon Oxide, Silicon Nitride and Low-k materials.

ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA (AMEC)

Primo D-RIE

The Primo Twin-Star® system is AMEC’s advanced 300mm etch product based on Inductively Coupled Plasma (ICP) technology. It is a cluster tool that can be conﬁgured with up to three dual-station chambers and two optional on-board integrated strip chambers. Each dual-station chamber can process one or two wafers at the same time with highly uniform and identical results. The ICP coils employ AMEC’s proprietary low capacitive coupling 3D coil design which enables more independent ion density and ion energy control. The electrostatic chuck has multi-zones with independent and dynamic temperature settings which enhances CD control. The chamber interior is coated with high-density plasma-resistant material for more robust process repeatability and more steady productivity. The product is intended for etching Si with various CD and depths in CIS and power device, and thin conductive/dielectric ﬁlms for various logic and DRAM IC devices. It has signiﬁcant cost advantages compared to single-station chamber product.

Primo Twin-Star

Through Silicon Via (TSV) has become a key technology for advanced packaging applications for various products such as CMOS image sensors, 2.5DICs, 3DICs and plasma dicing. The Primo TSV® tool is AMEC’s first high-density plasma TSV etch product for high-performance TSV applications. The system employs a cluster configuration design which allows for up to three dual-station process modules to be attached to the main frame. Each module can process two wafers simultaneously. AMEC offers 200mm and 300mm TSV production tools capable of etching holes with CDs ranging from hundreds of microns down to <1um, and depth of up to several hundred microns. In addition, with its strong process-tuning capabilities, the tool can generate diverse profiles based on customer requirements (i.e., vertical, cone-shaped, tapered, and more). Finally, with unique features, such as a pre-heating station, wafer-edge protection ring, and low-frequency RF pulsing bias and side gas feed, the Primo TSV is an ideal tool to deliver the technology, flexibility, and productivity needed for the TSV market.

Primo TSV300E

Primo SSC AD-RIE ® It is a single reaction dielectric etching product launched by Zhongwei in 2013, which is available in primo ad-rie ® On the basis of product technology and primo platform concept, six SLRs are integrated on one platform to maximize production capacity. In addition to the cavity design of the SLR that can transport gas independently, in order to meet the challenges of key processes below 2x nm, especially contact hole etching, the equipment also has the following characteristics: synchronous pulse RF system, cooling focusing ring process components and very low pressure gas pumping system. Primo SSC ad-rie is beneficial to deal with the micro load problem of multilayer film etching, the extreme edge morphology problem and the terminal control problem of contact hole etching. Primo SSC ad-rie has been steadily mass produced on the 16 nm chip production line of mainstream customers.

Primo SSC AD-RIE

iDEA stands for “integrated Dual-station Etch and Asher”. It represents a new concept developed by AMEC that integrates one or two dual-station D-RIE or AD-RIE process modules with a DsA (“Downstream Asher”) chamber on the same platform. AMEC’s DsA design is a dual-station chamber that utilizes a top-mounted remote plasma source (“RPS”) to create reactive species that are then uniformly delivered to the wafer surface for photo-resist removal. This approach not only effectively removes the photo-resist material, but also offers less direct plasma exposure to the wafer. This is important for customers running devices that are highly sensitive to surface charge build-up and potentially risk of plasma-induced damage (PID). Avoiding PID can involve exhaustive and expensive efforts to modify integration schemes or add dedicated machines for steps such as photo-resist removal. The fully integrated Primo iDEA® system offers a cost-effective solution to perform etch processing and dedicated photo-resist removal within the same platform.

Primo iDEA

Primo TSV200E

The Primo AD-RIE® system is AMEC’s second-generation dielectric etch product. Built upon the proven D-RIE architecture, the system embodies new proprietary designs featuring advanced capabilities such as a switchable dual-low-frequency RF generator, multi-zone gas distribution, and dual-chiller temperature control system. To maximize productivity, the AD-RIE system employs a cluster tool design that can be configured with up to three dual-station process modules (or six processing stations) per system. The AD-RIE product delivers the most advanced capabilities for new generation IC device manufacturing requirements, world wildly used for 40-7nm BEOL applications, and 10nm FEOL applications development and production.

Primo AD-RIE

Primo AD-RIE-e is configured with step-by-step temperature control 4-zone dynamic ESC, which helps improve etch uniformity and selectivity with wider process window.

Primo AD-RIE-e

The Primo nanova® tool is AMEC’s advanced 300mm etch product based on Inductively Coupled Plasma (ICP) technology. It is a cluster tool which can be configured with up to six chambers and two optional on-board integrated strip chambers. The chamber is symmetrical in design with high flow conductance. The ICP coils employ AMEC’s proprietary low capacitive coupling 3D coil design which enables more independent ion density and ion energy control. The chamber interior is coated with high-density plasma-resistant material for greater process repeatability and productivity. For wafer CD uniformity control, there is a high dynamic range multi-zone direct temperature-controlled ESC (electrostatic chuck). The product is intended for 1x or beyond etch applications for logic and memory devices.

Primo nanova

The Primo HD-RIE® system is AMEC’s latest-generation dielectric etch product, launched in 2015. Based on Primo SSC AD-RIETM platform with six etch processing stations capability to maximize productivity, the tool is designed to provide comprehensive solutions for middle and high aspect ratio (HAR) structure etch. New features include: High power synchronized RF pulsing, high power and high temperature ESC, gas pulsing, multiple-zone gas distribution, cooled focus ring process kits and enhanced lid temperature control. Primo HD-RIE has superb performance in middle and high aspect ratio (HAR) etch for 3D NAND and DRAM applications. The tool has already been deployed for critical applications in mass production.

Primo HD-RIE

The Primo AD-RIE-cr features corrosion resist chamber with AMEC’s proprietary surface coating technology, which offers solutions for dielectric, metal and metal oxide complicated structure etch.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA (AMEC)

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Primo TSV300E

Primo SSC AD-RIE

Primo D-RIE

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