Description
Sidewall etch, 32nanometerConfiguration
1ch SiN: CHA, 3 loadportsOEM Model Description
The eMax chamber operates in a new process regime that distinguishes it from other medium density plasma systems and enables the precise, high-throughput etching of very small, deep features. The system's unique, tunable, magnetic confinement technology and cost-effective approach to controlling temperature allow the eMax chamber to achieve low particle levels and extended MWBC (mean wafers between clean) intervals, resulting in a significant advantage in system cost-of-ownership.The eMax chambers are available on Applied Materials' enhanced Etch Centura II multi-chamber platform, which features a dual blade robotic handling system for increased throughput. The eMax Centura II can be configured with up to four process chambers, allowing a significant operational cost advantage over more limited capacity three-chamber systems. eMax chambers also can be added to existing Centura and Centura II platforms.Documents
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APPLIED MATERIALS (AMAT)
EMAX CT+
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
114043
Wafer Sizes:
12"/300mm
Vintage:
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
EMAX CT+
CATEGORY
Dry / Plasma Etch
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
114043
Wafer Sizes:
12"/300mm
Vintage:
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Sidewall etch, 32nanometerConfiguration
1ch SiN: CHA, 3 loadportsOEM Model Description
The eMax chamber operates in a new process regime that distinguishes it from other medium density plasma systems and enables the precise, high-throughput etching of very small, deep features. The system's unique, tunable, magnetic confinement technology and cost-effective approach to controlling temperature allow the eMax chamber to achieve low particle levels and extended MWBC (mean wafers between clean) intervals, resulting in a significant advantage in system cost-of-ownership.The eMax chambers are available on Applied Materials' enhanced Etch Centura II multi-chamber platform, which features a dual blade robotic handling system for increased throughput. The eMax Centura II can be configured with up to four process chambers, allowing a significant operational cost advantage over more limited capacity three-chamber systems. eMax chambers also can be added to existing Centura and Centura II platforms.Documents
No documents