Description
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Wafer EtchingOEM Model Description
Well-established in logic, memory, and foundry fabs worldwide, eMAX provides this extensive installed base with extendibility of a proven chamber.For next generation applications, optional hardware refinements (dual-zone gas feed, multiple RF frequencies, and enhanced pumping capability) produce higher etch rates, improved uniformity, and tighter profile control while eliminating wafer-edge effects. To balance selectivity versus etch capability, especially for high aspect ratio etch, eMAX operates in a low pressure/high gas flow regime complemented by process chemistries specifically tailored to optimize resist and baselayer selectivities.Rapid wafer handling, high etch rates, and four-chamber capabilities translate into high productivity. Effective polymer deposition management through temperature controls and plasma confinement facilitates extended production runs. Longer mean time between cleans (>150 RF hours), high system throughput, 90%+ up time, and low consumables costs combine to create a production-proven, reliable, cost-effective etch system.Documents
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CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
129838
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
EMAX CT+ CHAMBER
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
129838
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Wafer EtchingOEM Model Description
Well-established in logic, memory, and foundry fabs worldwide, eMAX provides this extensive installed base with extendibility of a proven chamber.For next generation applications, optional hardware refinements (dual-zone gas feed, multiple RF frequencies, and enhanced pumping capability) produce higher etch rates, improved uniformity, and tighter profile control while eliminating wafer-edge effects. To balance selectivity versus etch capability, especially for high aspect ratio etch, eMAX operates in a low pressure/high gas flow regime complemented by process chemistries specifically tailored to optimize resist and baselayer selectivities.Rapid wafer handling, high etch rates, and four-chamber capabilities translate into high productivity. Effective polymer deposition management through temperature controls and plasma confinement facilitates extended production runs. Longer mean time between cleans (>150 RF hours), high system throughput, 90%+ up time, and low consumables costs combine to create a production-proven, reliable, cost-effective etch system.Documents
No documents