Description
Dry Etch, Bx-, Cx-, E1 layers, 300mm wafers, 32nm BD/SICOH EtchConfiguration
No ConfigurationOEM Model Description
The Centura architecture clusters four processing stations and two auxiliary chambers around a central transfer module containing an ultra-reliable magnetically-coupled vacuum robot. To address advanced low k etch applications, the Applied Centura Enabler Etch system performs etch, strip and clean steps in a single chamber. The Enabler’s all-in-one capability streamlines the process flow for advanced chip designs and significantly reduces operating costs. Enabler Chamber: 300mm only.Documents
No documents
CATEGORY
Dry / Plasma Etch
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
143130
Wafer Sizes:
12"/300mm
Vintage:
2004
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
CENTURA ENABLER ETCH
CATEGORY
Dry / Plasma Etch
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
143130
Wafer Sizes:
12"/300mm
Vintage:
2004
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Dry Etch, Bx-, Cx-, E1 layers, 300mm wafers, 32nm BD/SICOH EtchConfiguration
No ConfigurationOEM Model Description
The Centura architecture clusters four processing stations and two auxiliary chambers around a central transfer module containing an ultra-reliable magnetically-coupled vacuum robot. To address advanced low k etch applications, the Applied Centura Enabler Etch system performs etch, strip and clean steps in a single chamber. The Enabler’s all-in-one capability streamlines the process flow for advanced chip designs and significantly reduces operating costs. Enabler Chamber: 300mm only.Documents
No documents