Description
EmaxConfiguration
EH_PIOEM Model Description
The AMAT CENTURA eMAX ETCH is an advanced dielectric etch system designed for fabricating semiconductor chip structures with feature sizes as small as 0.13 microns and beyond. It optimizes etching, photoresist strip, and barrier removal in a single chamber, reducing costs and cycle times. The system supports various applications, including etch, epitaxy, CVD, RTP, and plasma nitration. Its integration with existing Centura platforms allows for enhanced flexibility and adaptation to different process requirements. Introduced in June 2000, the eMAX ETCH specializes in etching a wide range of dielectric films, crucial for producing high-precision and reliable semiconductor devices in the contact and interconnect regions of chips. The Dielectric Etch eMax Centura was introduced in June 2000 as an extension of Applied's MxP+ and Super e dielectric process chamber designs. The Applied Centura eMax system etches a broad range of dielectric films in the contact and interconnect regions of the chip.Documents
No documents
CATEGORY
Dry / Plasma Etch
Last Verified: 12 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
144875
Wafer Sizes:
12"/300mm
Vintage:
2005
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
CENTURA eMAX ETCH
CATEGORY
Dry / Plasma Etch
Last Verified: 12 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
144875
Wafer Sizes:
12"/300mm
Vintage:
2005
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
EmaxConfiguration
EH_PIOEM Model Description
The AMAT CENTURA eMAX ETCH is an advanced dielectric etch system designed for fabricating semiconductor chip structures with feature sizes as small as 0.13 microns and beyond. It optimizes etching, photoresist strip, and barrier removal in a single chamber, reducing costs and cycle times. The system supports various applications, including etch, epitaxy, CVD, RTP, and plasma nitration. Its integration with existing Centura platforms allows for enhanced flexibility and adaptation to different process requirements. Introduced in June 2000, the eMAX ETCH specializes in etching a wide range of dielectric films, crucial for producing high-precision and reliable semiconductor devices in the contact and interconnect regions of chips. The Dielectric Etch eMax Centura was introduced in June 2000 as an extension of Applied's MxP+ and Super e dielectric process chamber designs. The Applied Centura eMax system etches a broad range of dielectric films in the contact and interconnect regions of the chip.Documents
No documents