Sorter
Feature:
Applicable PKG : FBGA, CSP, MCP, FLIP CHIP and QFN
High throughput and stability (45,000 UPH)
Process : Dead to Live, Dead to Dead available
Larger strip size (300mm x 120mm, 260mm x 200mm available)
Tray placement rate : 100% (RCPM)
Enhanced cleaning system (PVA and Bubble Jet)
Intelligent real-time monitoring system

Semes have achieved growth centering on cleaning, etching, and photo-track equipment used in the semiconductor manufacturing process. Also, the advancement has been shown in such sectors as test & package, semiconductor logistics automation equipment, and display OLED.

TEPAS

Category

Overview

Active Listings

Services

Top Listings

List it with Moov and find the perfect buyer in no time at all.