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Feature:
Applicable PKG : FBGA, CSP, MCP, FLIP CHIP and QFN
High throughput and stability (30,000 UPH)
Larger strip size (300mm x 120mm)
Tray placement rate : 100% (RCPM)
Enhanced cleaning system (PVA and Bubble Jet)
Intelligent real-time monitoring system (TBM & CBM)

Semes have achieved growth centering on cleaning, etching, and photo-track equipment used in the semiconductor manufacturing process. Also, the advancement has been shown in such sectors as test & package, semiconductor logistics automation equipment, and display OLED.

SW9000U

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