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BESI / DATACON CS 1250
    Description
    No description
    Configuration
    1) Power consumption : 5.0KVA 2) Input Voltage: 230V, 1 phase, ~ 50 / 60 Hz 3) Air Pressure: 6 Bar 4) Footprint: 1.95 m3 (1.65m W x 1.16m D) 5) Dry weight : 1,451Kg 6) Throughput: 16,000Device per hour 7) Wafer Size: 0.5mmx0.5mm to 12.5mmx12.5mm high aspect ratio die up to 10:1 8) Placement accuracy: Repeatability of +/-25µm(.001”) 9) Placement into pocket only 35 µm(.0015”) larger than the die 10) Bump inspection: 2D size +/-20% of nominal 11) Edge chip inspection: Detect edge chips from 15µm to 100µm 12) Post inspection: Tape seal integrity Die orientation, tombstone or tilted 13) Up-time, robustness: MTBF=500 hours, MTTR=30minutes, MTBA=2 hours, MTTA=3minutes
    OEM Model Description
    Sort to Tape Reel at up to 16,500 UPH
    Documents

    No documents

    BESI / DATACON

    CS 1250

    verified-listing-icon

    Verified

    CATEGORY

    Die Sorters & Attachers
    Last Verified: Over 60 days ago
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    13921


    Wafer Sizes:

    Unknown


    Vintage:

    2008

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    BESI / DATACON CS 1250
    BESI / DATACONCS 1250Die Sorters & Attachers
    Vintage: 0Condition: Used
    Last VerifiedOver 30 days ago

    BESI / DATACON

    CS 1250

    verified-listing-icon

    Verified

    CATEGORY

    Die Sorters & Attachers
    Last Verified: Over 60 days ago
    listing-photo-8IvE1cqy7JqkBypevQN2cbfb7Kaa7yalDdslH8P4V04-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1995/8IvE1cqy7JqkBypevQN2cbfb7Kaa7yalDdslH8P4V04/c24bcc5d15a8462fb9db1bd833125318_screenshot20200617at3_f.jpeg
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    13921


    Wafer Sizes:

    Unknown


    Vintage:

    2008


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    1) Power consumption : 5.0KVA 2) Input Voltage: 230V, 1 phase, ~ 50 / 60 Hz 3) Air Pressure: 6 Bar 4) Footprint: 1.95 m3 (1.65m W x 1.16m D) 5) Dry weight : 1,451Kg 6) Throughput: 16,000Device per hour 7) Wafer Size: 0.5mmx0.5mm to 12.5mmx12.5mm high aspect ratio die up to 10:1 8) Placement accuracy: Repeatability of +/-25µm(.001”) 9) Placement into pocket only 35 µm(.0015”) larger than the die 10) Bump inspection: 2D size +/-20% of nominal 11) Edge chip inspection: Detect edge chips from 15µm to 100µm 12) Post inspection: Tape seal integrity Die orientation, tombstone or tilted 13) Up-time, robustness: MTBF=500 hours, MTTR=30minutes, MTBA=2 hours, MTTA=3minutes
    OEM Model Description
    Sort to Tape Reel at up to 16,500 UPH
    Documents

    No documents

    Similar Listings
    View All
    BESI / DATACON CS 1250
    BESI / DATACON
    CS 1250
    Die Sorters & AttachersVintage: 0Condition: UsedLast Verified: Over 30 days ago
    BESI / DATACON CS 1250
    BESI / DATACON
    CS 1250
    Die Sorters & AttachersVintage: 0Condition: UsedLast Verified: Over 60 days ago
    BESI / DATACON CS 1250
    BESI / DATACON
    CS 1250
    Die Sorters & AttachersVintage: 0Condition: UsedLast Verified: Over 60 days ago