The ESEC CT-2000 series of assembly machines provides the  flexibility to perform a number of different applications based upon a standard high-performance platform. Turnkey systems includes solutions for die bonding, flip chip sorting, component transfer and final mechanical assembly.

BE Semiconductor Industries N.V. designs, develops, manufactures, markets and services die sorting, flip chip and multi-chip die bonding, packaging and plating equipment for the semiconductor industry's assembly operations.
Founded in 1968, Esec is a leading global manufacturer of die bonding equipment for the semiconductor, telecommunications and smart card industries based in Cham, Switzerland. It also manufactures and services wire bonding systems from its Singapore assembly facility.

BESI / ESEC

CT-2000

Automatic Flip Chip Die Attacher, 3ea Available

CT-2000

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