Skip to main content
Marketplace > Die Sorters and Attachers > ASM > IS868LA2
ASM IS868LA2
    Have one like this?Sell it with Moov
    Key Item Details

    Condition:Used

    Operational Status:

    Product ID:79190

    Wafer Sizes:Unknown

    Vintage:Unknown

    Description

    No description available

    Configuration

    No Configuration

    Documents
    No documents
    OEM Model Description

    The ASM IS868LA2 is a die bonder machine used in the semiconductor industry for attaching semiconductor chips to a substrate

    Available Services

    Moov goes beyond the transaction to ensure a seamless buying experience from start to finish.

    • Money Back Guarantee

      Now free!

      Let Moov take the risk out of purchasing secondhand equipment with our 'No questions asked Money Back Guarantee' Learn more

    • Logistics

      One stop shop for Moov-ing equipment anywhere globally.

    • Insurance

      Moov-ing equipment can be risky. Let us take on that risk so you can relax while your equipment is in transit.

    • Refurbishment

      Need a tool built to the required specifications? Moov's refurbishment team has over 20 years of experience.

    Similar Listings
    See Similar Listings