The ASM AD9312 is a cutting-edge wire bonder equipped with shared optics technology, enabling exceptional bonding accuracy. It incorporates intelligent bond head active tilting control and patented active vibration control to ensure high-quality bonding results with excellent coplanarity and stability.

ASM is a supplier of semiconductor process equipment for wafer processing, including lithography, deposition, ion implant and single-wafer epitaxy. ASM is part of the ASM International NV group that also includes ASM Pacific Technology (ASMPT). ASMPT, in which ASMI holds a substantial ownership is a leading supplier of semiconductor process equipment for wafer assembly and packaging, and for surface mount technology.



AD9312

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