Description
Die BonderConfiguration
No ConfigurationOEM Model Description
The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.Documents
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ASM
AD898
Verified
CATEGORY
Die Sorters & Attachers
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
62762
Wafer Sizes:
Unknown
Vintage:
Unknown
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Logistics Support
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Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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ASM
AD898
Verified
CATEGORY
Die Sorters & Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
62762
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Die BonderConfiguration
No ConfigurationOEM Model Description
The ASM AD898 is a state-of-the-art Die Bonder by ASM, representing a new generation of advanced technology. This fully automatic die bonding machine offers remarkable capabilities, accommodating up to 8" wafers. Its flexibility extends to handling a wide range of die sizes and leadframe/substrate configurations, allowing for quick and easy package conversion. Equipped with a fast and reliable linear bond head, high accuracy linear motor indexer platform, and high-speed Eagle Pattern Recognition System with pre/post bond inspection, the AD898 ensures precise and efficient die bonding processes. Additionally, it features a 2-in-1 epoxy writer system, further enhancing its capabilities for semiconductor manufacturing applications.Documents
No documents