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Description
standard 12" wafe flip chip bonder configuration, conditional very goodConfiguration
slot magazine (pick head )onload, flip chip module ,slot offload, standard configurationOEM Model Description
The ASM AD8312FC is an advanced Automatic Die Bonding System designed for handling 12-inch wafers. It offers the capability of direct die attach mode, in addition to the standard flip chip process. This system provides efficient and precise die bonding solutions, making it suitable for various semiconductor assembly applications, including direct die attach processes for specific requirements.Documents
No documents
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
59681
Wafer Sizes:
12"/300mm
Vintage:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASM
AD8312FC
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
59681
Wafer Sizes:
12"/300mm
Vintage:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
standard 12" wafe flip chip bonder configuration, conditional very goodConfiguration
slot magazine (pick head )onload, flip chip module ,slot offload, standard configurationOEM Model Description
The ASM AD8312FC is an advanced Automatic Die Bonding System designed for handling 12-inch wafers. It offers the capability of direct die attach mode, in addition to the standard flip chip process. This system provides efficient and precise die bonding solutions, making it suitable for various semiconductor assembly applications, including direct die attach processes for specific requirements.Documents
No documents