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ASM AD8312FC
    Description
    Die bonder
    Configuration
    No Configuration
    OEM Model Description
    The ASM AD8312FC is an advanced Automatic Die Bonding System designed for handling 12-inch wafers. It offers the capability of direct die attach mode, in addition to the standard flip chip process. This system provides efficient and precise die bonding solutions, making it suitable for various semiconductor assembly applications, including direct die attach processes for specific requirements.
    Documents

    No documents

    ASM

    AD8312FC

    verified-listing-icon

    Verified

    CATEGORY

    Die Sorters & Attachers
    Last Verified: Over 60 days ago
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    65365

    Wafer Sizes:

    Unknown

    Vintage:

    2015

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    Logistics Support
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    Money Back Guarantee
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    Transaction Insured by Moov
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    Refurbishment Services
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    ASM

    AD8312FC

    verified-listing-icon

    Verified

    CATEGORY

    Die Sorters & Attachers
    Last Verified: Over 60 days ago
    listing-photo-17b43be5ff3a4c16886605b01a1b7d4b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/50884/17b43be5ff3a4c16886605b01a1b7d4b/27506a84d3474737bab1f11b32edad9c_9eb456ca99ff4fe78a4eb5fbc74a14091201a_mw.jpeg
    listing-photo-17b43be5ff3a4c16886605b01a1b7d4b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/50884/17b43be5ff3a4c16886605b01a1b7d4b/35cc4b9efac54d9194977e011b0fe196_81dfadb70932416ca86299bffc6d61001201a_mw.jpeg
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    65365

    Wafer Sizes:

    Unknown

    Vintage:

    2015

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Die bonder
    Configuration
    No Configuration
    OEM Model Description
    The ASM AD8312FC is an advanced Automatic Die Bonding System designed for handling 12-inch wafers. It offers the capability of direct die attach mode, in addition to the standard flip chip process. This system provides efficient and precise die bonding solutions, making it suitable for various semiconductor assembly applications, including direct die attach processes for specific requirements.
    Documents

    No documents

    Similar Listings
    View All
    ASM AD8312FC
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    Die Sorters & AttachersVintage: 2015Condition: UsedLast Verified: Over 60 days ago
    ASM AD8312FC
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    AD8312FC
    Die Sorters & AttachersVintage: 2015Condition: UsedLast Verified: Over 60 days ago
    ASM AD8312FC
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    Die Sorters & AttachersVintage: 2017Condition: UsedLast Verified: Over 60 days ago