Description
Solidifying machine and laminating machineConfiguration
No ConfigurationOEM Model Description
The SPA-300 Super is a high-speed epoxy die bonder that is compatible with stacked die and thin die. It is also compatible with 150-300mm wafers and is designed for bonding Lead Frame, Singulated BGA, and Flex Tape. . It has an ultra-thin wafer/die handling mechanism that supports the latest thin packages. The digitization of each setting enables flexible multi-model support. A magazine loader stocker model is also available. The SPA-300 Super has a high-rigidity casting integrated structure body that achieves excellent damping. It also has a friendly operation by adopting GUI. Various optional functions support ultra-thin die bonding and stacked package production. The SPA-300 Super has achieved higher throughput by improving the machine cycle. It is equipped with a post-bonding inspection function to enable bonding quality control. The SPA-300 Super is compatible with 0.35mm minimum dies, contributing to the production of MCM and SiP (option).Documents
No documents
SHINKAWA
SPA 300 SUPER
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79203
Wafer Sizes:
Unknown
Vintage:
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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SHINKAWA
SPA 300 SUPER
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79203
Wafer Sizes:
Unknown
Vintage:
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Solidifying machine and laminating machineConfiguration
No ConfigurationOEM Model Description
The SPA-300 Super is a high-speed epoxy die bonder that is compatible with stacked die and thin die. It is also compatible with 150-300mm wafers and is designed for bonding Lead Frame, Singulated BGA, and Flex Tape. . It has an ultra-thin wafer/die handling mechanism that supports the latest thin packages. The digitization of each setting enables flexible multi-model support. A magazine loader stocker model is also available. The SPA-300 Super has a high-rigidity casting integrated structure body that achieves excellent damping. It also has a friendly operation by adopting GUI. Various optional functions support ultra-thin die bonding and stacked package production. The SPA-300 Super has achieved higher throughput by improving the machine cycle. It is equipped with a post-bonding inspection function to enable bonding quality control. The SPA-300 Super is compatible with 0.35mm minimum dies, contributing to the production of MCM and SiP (option).Documents
No documents