SW6000 PLUS
Overview
Sorter Feature: Applicable PKG : FBGA, CSP, MCP, FLIP CHIP and QFN High throughput (25,000 UPH) Process : From dead bug (Ball up) to live bug (Ball down offloading) Vision inspection : orientation, ball, mark, PKG align and side vision (optional) Tray placement rate : 100% (RCPM) Easy conversion and maintenance Enhanced cleaning system (PVA and Bubble Jet)
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