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MECH-EL 907
  • MECH-EL 907
Description
No description
Configuration
No Configuration
OEM Model Description
The Mech-El/MEI 709 is a manual eutectic die attacher. The machine comes with a 2 position slide table for die presentation and heated work holder. The MEI 709 uses a unique hot gas head that allows the user to heat the package to a temperature below the wetting temperature of the solder and use the hot gas to bring the localized heat to only the die area to wet the solder or perform.
Documents

No documents

verified-listing-icon

Verified

CATEGORY
Die Bonders / Sorters / Attachers

Last Verified: Over 30 days ago

Buyer pays 12% premium of final sale price
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

120293


Wafer Sizes:

Unknown


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

MECH-EL

907

verified-listing-icon
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 30 days ago
listing-photo-6e78b08a9a07414a8d0aadba58203525-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1116/6e78b08a9a07414a8d0aadba58203525/a980a0f513494a55b2a627597aa454be_d5be36a6d90544298bb98c509e37ba7f_mw.jpeg
Buyer pays 12% premium of final sale price
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

120293


Wafer Sizes:

Unknown


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No description
Configuration
No Configuration
OEM Model Description
The Mech-El/MEI 709 is a manual eutectic die attacher. The machine comes with a 2 position slide table for die presentation and heated work holder. The MEI 709 uses a unique hot gas head that allows the user to heat the package to a temperature below the wetting temperature of the solder and use the hot gas to bring the localized heat to only the die area to wet the solder or perform.
Documents

No documents