Description
Includes: New touch screen with recipes Timed parameters: pre scrub, scrub and post scrub times Temperatures : work holder, tip and power output to hot gas heater Scrub frequency Can be programmed to hold bond head down for variable amount of time Emergency release button for bond headConfiguration
Mechel 709/703 hot gas bonderOEM Model Description
The Mech-El/MEI 703 is a manual eutectic die attacher. The machine comes with a 2 position slide table for die presentation and heated work holder. The MEI 703 uses a unique hot gas head that allows the user to heat the package to a temperature below the wetting temperature of the solder and use the hot gas to bring the localized heat to only the die area to wet the solder or perform.Documents
No documents
MECH-EL
703
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
60952
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
MECH-EL
703
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
60952
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Includes: New touch screen with recipes Timed parameters: pre scrub, scrub and post scrub times Temperatures : work holder, tip and power output to hot gas heater Scrub frequency Can be programmed to hold bond head down for variable amount of time Emergency release button for bond headConfiguration
Mechel 709/703 hot gas bonderOEM Model Description
The Mech-El/MEI 703 is a manual eutectic die attacher. The machine comes with a 2 position slide table for die presentation and heated work holder. The MEI 703 uses a unique hot gas head that allows the user to heat the package to a temperature below the wetting temperature of the solder and use the hot gas to bring the localized heat to only the die area to wet the solder or perform.Documents
No documents