Description
Die / Hybrid Bonder Power Spec (V/kW) - 380V 4.2KW Dimensions L×W×H (mm) - 2050*1215*2050 Weight (kg) - 2300 Accessories Completeness - Main machine +IUPC loading and unloadingConfiguration
Cell Footprint - ≈2000 mm class Placement Heads - Same platform (Infotech Die/Hybrid Bonder) Wafer Handling - Same platform (Infotech Die/Hybrid Bonder) Wafer Changer & Feeder -Same platform (Infotech Die/Hybrid Bonder) Placement Accuracy - Same platform (Infotech Die/Hybrid Bonder) Process Capability - Same platform (Infotech Die/Hybrid Bonder) Workpiece Transport - Same platform (Infotech Die/Hybrid Bonder) Perform Feeding - Same platform (Infotech Die/Hybrid Bonder) Heating & Bond Force - Same platform (Infotech Die/Hybrid Bonder) System Interface - Same platform (Infotech Die/Hybrid Bonder) Standard Features - Same platform (Infotech Die/Hybrid Bonder) IC - 2000 Cell Extras: Polyimide dispensing, N2/plasma cleaning, housing-seal dispensing, ink-jet marking, internal curing stations, optional load/unload modulesOEM Model Description
Die BonderDocuments
No documents
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
154519
Wafer Sizes:
Unknown
Vintage:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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INFOTECH AUTOMATION
IC-2000
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
154519
Wafer Sizes:
Unknown
Vintage:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Die / Hybrid Bonder Power Spec (V/kW) - 380V 4.2KW Dimensions L×W×H (mm) - 2050*1215*2050 Weight (kg) - 2300 Accessories Completeness - Main machine +IUPC loading and unloadingConfiguration
Cell Footprint - ≈2000 mm class Placement Heads - Same platform (Infotech Die/Hybrid Bonder) Wafer Handling - Same platform (Infotech Die/Hybrid Bonder) Wafer Changer & Feeder -Same platform (Infotech Die/Hybrid Bonder) Placement Accuracy - Same platform (Infotech Die/Hybrid Bonder) Process Capability - Same platform (Infotech Die/Hybrid Bonder) Workpiece Transport - Same platform (Infotech Die/Hybrid Bonder) Perform Feeding - Same platform (Infotech Die/Hybrid Bonder) Heating & Bond Force - Same platform (Infotech Die/Hybrid Bonder) System Interface - Same platform (Infotech Die/Hybrid Bonder) Standard Features - Same platform (Infotech Die/Hybrid Bonder) IC - 2000 Cell Extras: Polyimide dispensing, N2/plasma cleaning, housing-seal dispensing, ink-jet marking, internal curing stations, optional load/unload modulesOEM Model Description
Die BonderDocuments
No documents