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INFOTECH AUTOMATION IC-1600
    Description
    Same platform (Infotech Die/Hybrid Bonder) Power Spec (V/kW) - 380V 3KW Dimensions L×W×H (mm) - 1614*1215*2050 Weight (kg) - 1690 Accessories Completeness - Main machine +IUPC loading and unloading
    Configuration
    Cell Footprint - ≈1600 mm class Placement Heads - Same platform (Infotech Die/Hybrid Bonder) Wafer Handling - Same platform (Infotech Die/Hybrid Bonder) Wafer Changer & Feeder -Same platform (Infotech Die/Hybrid Bonder) Placement Accuracy - Same platform (Infotech Die/Hybrid Bonder) Process Capability - Same platform (Infotech Die/Hybrid Bonder) Workpiece Transport - Same platform (Infotech Die/Hybrid Bonder) Perform Feeding - Same platform (Infotech Die/Hybrid Bonder) Heating & Bond Force - Same platform (Infotech Die/Hybrid Bonder) System Interface - Same platform (Infotech Die/Hybrid Bonder) Standard Features - Same platform (Infotech Die/Hybrid Bonder)
    OEM Model Description
    Die Bonder
    Documents

    No documents

    INFOTECH AUTOMATION

    IC-1600

    verified-listing-icon

    Verified

    CATEGORY
    Die Bonders / Sorters / Attachers

    Last Verified: Yesterday

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    153371

    Wafer Sizes:

    Unknown

    Vintage:

    2022

    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    INFOTECH AUTOMATION IC-1600

    INFOTECH AUTOMATION

    IC-1600

    Die Bonders / Sorters / Attachers
    Vintage: 2022Condition: Used
    Last VerifiedYesterday
    INFOTECH AUTOMATION IC-1600

    INFOTECH AUTOMATION

    IC-1600

    Die Bonders / Sorters / Attachers
    Vintage: 2022Condition: Used
    Last VerifiedYesterday

    INFOTECH AUTOMATION

    IC-1600

    verified-listing-icon
    Verified
    CATEGORY
    Die Bonders / Sorters / Attachers
    Last Verified: Yesterday
    listing-photo-81b6aab50738400080fc41aa47c91d89-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/93230/81b6aab50738400080fc41aa47c91d89/c313dcb617d940ff9f1dfe5de2c0c709_1_mw.jpg
    listing-photo-81b6aab50738400080fc41aa47c91d89-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/93230/81b6aab50738400080fc41aa47c91d89/d1b9b6ac9cf24234a9709c402b92615e_2_mw.png
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    153371

    Wafer Sizes:

    Unknown

    Vintage:

    2022

    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Same platform (Infotech Die/Hybrid Bonder) Power Spec (V/kW) - 380V 3KW Dimensions L×W×H (mm) - 1614*1215*2050 Weight (kg) - 1690 Accessories Completeness - Main machine +IUPC loading and unloading
    Configuration
    Cell Footprint - ≈1600 mm class Placement Heads - Same platform (Infotech Die/Hybrid Bonder) Wafer Handling - Same platform (Infotech Die/Hybrid Bonder) Wafer Changer & Feeder -Same platform (Infotech Die/Hybrid Bonder) Placement Accuracy - Same platform (Infotech Die/Hybrid Bonder) Process Capability - Same platform (Infotech Die/Hybrid Bonder) Workpiece Transport - Same platform (Infotech Die/Hybrid Bonder) Perform Feeding - Same platform (Infotech Die/Hybrid Bonder) Heating & Bond Force - Same platform (Infotech Die/Hybrid Bonder) System Interface - Same platform (Infotech Die/Hybrid Bonder) Standard Features - Same platform (Infotech Die/Hybrid Bonder)
    OEM Model Description
    Die Bonder
    Documents

    No documents

    Similar Listings
    View All
    INFOTECH AUTOMATION IC-1600

    INFOTECH AUTOMATION

    IC-1600

    Die Bonders / Sorters / AttachersVintage: 2022Condition: UsedLast Verified:Yesterday
    INFOTECH AUTOMATION IC-1600

    INFOTECH AUTOMATION

    IC-1600

    Die Bonders / Sorters / AttachersVintage: 2022Condition: UsedLast Verified:Yesterday