Description
Die Bonder production cell for power-module assembly Power Spec (V/kW) - 380V 3KW Dimensions L×W×H (mm) - 1215*1215*2050 Weight (kg) - 1500 Main machine +IUPC loading and unloadingConfiguration
Cell Footprint - 1200 × 1200 mm Placement Heads - 6 Parallel Heads Wafer Handler - 4-12' Wafer Changer & Feeder - 4-12' Placement Accuracy - 3 µm ± 3 µm demonstrated in high-precision eutectic application; power-module figure not published Workpiece Transport - XL carrier 460×330 mm (fixed) or 85–330 mm width-adjustable; XXL 650×330 mm; trays up to 330 mm wide Perform Feeding - PF2-14 / PF12-26 / PF22-40 (strip 2–40 mm); PS32-66 stack feeder (32–66 mm) Heating & Bonding Force - Process heat up to 300 °C; bond force up to 300 N (optional 500 N) System Interface - SECS/GEM MES; synchronized interface with PINK VADU 300/400 vacuum reflow ovens Standdard Features - Centering station with force-measuring table & optional pre-heat; automatic nozzle / eject-pin changer; all calibration options includedOEM Model Description
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Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
153370
Wafer Sizes:
Unknown
Vintage:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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INFOTECH AUTOMATION
IC-1200
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
153370
Wafer Sizes:
Unknown
Vintage:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Die Bonder production cell for power-module assembly Power Spec (V/kW) - 380V 3KW Dimensions L×W×H (mm) - 1215*1215*2050 Weight (kg) - 1500 Main machine +IUPC loading and unloadingConfiguration
Cell Footprint - 1200 × 1200 mm Placement Heads - 6 Parallel Heads Wafer Handler - 4-12' Wafer Changer & Feeder - 4-12' Placement Accuracy - 3 µm ± 3 µm demonstrated in high-precision eutectic application; power-module figure not published Workpiece Transport - XL carrier 460×330 mm (fixed) or 85–330 mm width-adjustable; XXL 650×330 mm; trays up to 330 mm wide Perform Feeding - PF2-14 / PF12-26 / PF22-40 (strip 2–40 mm); PS32-66 stack feeder (32–66 mm) Heating & Bonding Force - Process heat up to 300 °C; bond force up to 300 N (optional 500 N) System Interface - SECS/GEM MES; synchronized interface with PINK VADU 300/400 vacuum reflow ovens Standdard Features - Centering station with force-measuring table & optional pre-heat; automatic nozzle / eject-pin changer; all calibration options includedOEM Model Description
None ProvidedDocuments
No documents