Description
Flip Chip Bonder, workingConfiguration
No ConfigurationOEM Model Description
HANMI Semiconductor FLIP CHIP BONDER-A110 released recently has over 6000UPH capacity which is certainly superior to its competitors UPH 3000~4000.Documents
No documents
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
131539
Wafer Sizes:
Unknown
Vintage:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
HANMI
FLIP CHIP BONDER-A110
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
131539
Wafer Sizes:
Unknown
Vintage:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Flip Chip Bonder, workingConfiguration
No ConfigurationOEM Model Description
HANMI Semiconductor FLIP CHIP BONDER-A110 released recently has over 6000UPH capacity which is certainly superior to its competitors UPH 3000~4000.Documents
No documents