Description
Alignment camera: Lun/Pixel filed of view 3.8mm*2 7mm, resolution lun/pixel Working machine area: X-axis maximum travel ≥350 mm, stepless control: Y-axis maximum travel ≥150 mm, infinitely adjustable: 2-axis maximum travel ≥ 8 mm, stepless control: X-axis ≥350 mm Y-axis ≥150 mm Z-axis ≥8 mm all adjust by nicrometer Bonding force setting0.2-500n Heating plate, 50*50mm heated area, maximum setting temp 450°C programable Chip heating module, maximum setting temp 450°C programableConfiguration
Configure substrate protection gas module: Insert gas chamber Configure the side view camera module: Process video moduleOEM Model Description
Die BonderDocuments
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
New
Operational Status:
Unknown
Product ID:
112933
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
FINETECH INC
FINEPLACER sigma
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
New
Operational Status:
Unknown
Product ID:
112933
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available