Description
includes a 50 x 50mm and/or a 100 x 100mm substrate heater, 80W Chip Contact Heater, 0.2-20N Bond Force Module, a side view Process Camera, Y Camera Shift, a dispense syringe mechanism (no controller) and a win10 Pro PCConfiguration
spec’d to place to <0.5umOEM Model Description
None ProvidedDocuments
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: 15 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
137843
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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FINETECH INC
FINEPLACER lambda
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: 15 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
137843
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available