Description
No descriptionConfiguration
No ConfigurationOEM Model Description
High accuracy die bonder with the 2-in-1 concept, which supports a stacked die packaging with DAF process and general-purpose products of paste process. It can be switched easily between direct mode and parallel mode, which enables flexible production that supports the optimal process. Productivity Use of intermediate stage ensures high quality and high productivity Multilayering support • Improved accuracy of bonding placement • Integrated vision system with position correction • Clean operation support reduces particle contamination during multilayering Thin die bonding technology • Multi-stage pickup enables thin die pickup operation • Wide variety of bonding sequences helps to reduce die stressesDocuments
No documents
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
133517
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
FASFORD
DB830plus+
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
133517
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
High accuracy die bonder with the 2-in-1 concept, which supports a stacked die packaging with DAF process and general-purpose products of paste process. It can be switched easily between direct mode and parallel mode, which enables flexible production that supports the optimal process. Productivity Use of intermediate stage ensures high quality and high productivity Multilayering support • Improved accuracy of bonding placement • Integrated vision system with position correction • Clean operation support reduces particle contamination during multilayering Thin die bonding technology • Multi-stage pickup enables thin die pickup operation • Wide variety of bonding sequences helps to reduce die stressesDocuments
No documents