Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The Datacon 2200 evo plus is a versatile die bonder specifically designed for Multi Module Attach, capable of assembling various technologies on a reliable platform. This advanced machine comes with key enhancements, offering improved bonding accuracy and cost-effectiveness. With unparalleled flexibility and extensive customization options, the Datacon 2200 evo plus incorporates a new camera system and thermal compensation algorithm, ensuring higher accuracy and long-term stability. Additionally, its new image processing unit enables faster operation, contributing to increased speed.Documents
No documents
BESI / DATACON
2200 EVO plus
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
101656
Wafer Sizes:
Unknown
Vintage:
2021
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View All
BESI / DATACON
2200 EVO plus
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
101656
Wafer Sizes:
Unknown
Vintage:
2021
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The Datacon 2200 evo plus is a versatile die bonder specifically designed for Multi Module Attach, capable of assembling various technologies on a reliable platform. This advanced machine comes with key enhancements, offering improved bonding accuracy and cost-effectiveness. With unparalleled flexibility and extensive customization options, the Datacon 2200 evo plus incorporates a new camera system and thermal compensation algorithm, ensuring higher accuracy and long-term stability. Additionally, its new image processing unit enables faster operation, contributing to increased speed.Documents
No documents