
Description
Automatic Die Bonder Newer Used in Prodcution Die Attach, Flip Chip & Multi-Chip Capability Upgraded Camera Upgraded Image Processing Unit Large Format Heated Stage Thermal Compensation Open Platform ArchitectureConfiguration
No ConfigurationOEM Model Description
The Datacon 2200 evo plus is a versatile die bonder specifically designed for Multi Module Attach, capable of assembling various technologies on a reliable platform. This advanced machine comes with key enhancements, offering improved bonding accuracy and cost-effectiveness. With unparalleled flexibility and extensive customization options, the Datacon 2200 evo plus incorporates a new camera system and thermal compensation algorithm, ensuring higher accuracy and long-term stability. Additionally, its new image processing unit enables faster operation, contributing to increased speed.Documents
No documents
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
129666
Wafer Sizes:
Unknown
Vintage:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View AllBESI / DATACON
2200 EVO plus
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
129666
Wafer Sizes:
Unknown
Vintage:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Automatic Die Bonder Newer Used in Prodcution Die Attach, Flip Chip & Multi-Chip Capability Upgraded Camera Upgraded Image Processing Unit Large Format Heated Stage Thermal Compensation Open Platform ArchitectureConfiguration
No ConfigurationOEM Model Description
The Datacon 2200 evo plus is a versatile die bonder specifically designed for Multi Module Attach, capable of assembling various technologies on a reliable platform. This advanced machine comes with key enhancements, offering improved bonding accuracy and cost-effectiveness. With unparalleled flexibility and extensive customization options, the Datacon 2200 evo plus incorporates a new camera system and thermal compensation algorithm, ensuring higher accuracy and long-term stability. Additionally, its new image processing unit enables faster operation, contributing to increased speed.Documents
No documents