Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership.Documents
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Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Today
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
127860
Wafer Sizes:
Unknown
Vintage:
2018
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BESI / ESEC
2100 hS
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Today
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
127860
Wafer Sizes:
Unknown
Vintage:
2018
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership.Documents
No documents