Description
No descriptionConfiguration
Automatic Flip Chip Die AttacherOEM Model Description
The ESEC CT-2000 series of assembly machines provides the flexibility to perform a number of different applications based upon a standard high-performance platform. Turnkey systems includes solutions for die bonding, flip chip sorting, component transfer and final mechanical assembly.Documents
No documents
BESI / ESEC
CT-2000
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
93590
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
CT-2000
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
93590
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Automatic Flip Chip Die AttacherOEM Model Description
The ESEC CT-2000 series of assembly machines provides the flexibility to perform a number of different applications based upon a standard high-performance platform. Turnkey systems includes solutions for die bonding, flip chip sorting, component transfer and final mechanical assembly.Documents
No documents