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6" Fab For Sale from Moov - Click Here to Learn More
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BESI / ESEC 2100 xP
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The Die Bonder 2100 xP from Esec achieves with its revolutionary machine layout an increase in productivity of more than 80% in relation to conventional solutions. The rotational movement utilized by the new Die Bonder 2100 xP from Esec manages four chip placements per second with a precision of 5 µm - a leading-edge achievement in robotics and an absolutely stellar performance in the industry.
    Documents

    No documents

    BESI / ESEC

    2100 xP

    verified-listing-icon

    Verified

    CATEGORY
    Die Bonders / Sorters / Attachers

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Refurbished


    Operational Status:

    Unknown


    Product ID:

    27595


    Wafer Sizes:

    Unknown


    Vintage:

    2012


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    BESI / ESEC 2100 xP

    BESI / ESEC

    2100 xP

    Die Bonders / Sorters / Attachers
    Vintage: 2012Condition: Refurbished
    Last VerifiedOver 60 days ago

    BESI / ESEC

    2100 xP

    verified-listing-icon
    Verified
    CATEGORY
    Die Bonders / Sorters / Attachers
    Last Verified: Over 60 days ago
    listing-photo-9471bff10db44a44a6057fb3a0bd630b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1705/9471bff10db44a44a6057fb3a0bd630b/399db9ddf9b948699d2509c3ce5da0cc_1a15e87e2dd6471f8482fbe2fccf34f61105c_f.jpeg
    listing-photo-9471bff10db44a44a6057fb3a0bd630b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1705/9471bff10db44a44a6057fb3a0bd630b/2ccfd973c2cf474ba5e5ba7493d98daf_7a6f53d5e44d45e8bb5f55111221f8e11105c_f.jpeg
    listing-photo-9471bff10db44a44a6057fb3a0bd630b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1705/9471bff10db44a44a6057fb3a0bd630b/3c2ed6e32fac42bd97e50930a997e011_dba911cdab7c44cba0e09ed362b2dfd91105c_f.jpeg
    Key Item Details

    Condition:

    Refurbished


    Operational Status:

    Unknown


    Product ID:

    27595


    Wafer Sizes:

    Unknown


    Vintage:

    2012


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The Die Bonder 2100 xP from Esec achieves with its revolutionary machine layout an increase in productivity of more than 80% in relation to conventional solutions. The rotational movement utilized by the new Die Bonder 2100 xP from Esec manages four chip placements per second with a precision of 5 µm - a leading-edge achievement in robotics and an absolutely stellar performance in the industry.
    Documents

    No documents

    Similar Listings
    View All
    BESI / ESEC 2100 xP

    BESI / ESEC

    2100 xP

    Die Bonders / Sorters / AttachersVintage: 2012Condition: RefurbishedLast Verified:Over 60 days ago