Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The Die Bonder 2100 xP from Esec achieves with its revolutionary machine layout an increase in productivity of more than 80% in relation to conventional solutions. The rotational movement utilized by the new Die Bonder 2100 xP from Esec manages four chip placements per second with a precision of 5 µm - a leading-edge achievement in robotics and an absolutely stellar performance in the industry.Documents
No documents
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Today
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
127774
Wafer Sizes:
Unknown
Vintage:
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2100 xP
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Today
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
127774
Wafer Sizes:
Unknown
Vintage:
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The Die Bonder 2100 xP from Esec achieves with its revolutionary machine layout an increase in productivity of more than 80% in relation to conventional solutions. The rotational movement utilized by the new Die Bonder 2100 xP from Esec manages four chip placements per second with a precision of 5 µm - a leading-edge achievement in robotics and an absolutely stellar performance in the industry.Documents
No documents