Description
Flip Chip Die BonderConfiguration
- 0 µm accuracy - Up to 12k UPH - 230 VOEM Model Description
The ESEC 2100 FC hS is the third generation of the highly regarded High-Speed Flip Chip platform, designed to handle a wide array of Flip Chip applications, including FCOL, FC-MIS, FC-SIP, FCCSP, FCBGA, and emerging packages like CSP-LED. This advanced bonder delivers exceptional ease of operation, providing seamless production control and assistanceDocuments
No documents
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: 13 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
152704
Wafer Sizes:
12"/300mm
Vintage:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BESI / ESEC
2100 FC hS
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: 13 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
152704
Wafer Sizes:
12"/300mm
Vintage:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Flip Chip Die BonderConfiguration
- 0 µm accuracy - Up to 12k UPH - 230 VOEM Model Description
The ESEC 2100 FC hS is the third generation of the highly regarded High-Speed Flip Chip platform, designed to handle a wide array of Flip Chip applications, including FCOL, FC-MIS, FC-SIP, FCCSP, FCBGA, and emerging packages like CSP-LED. This advanced bonder delivers exceptional ease of operation, providing seamless production control and assistanceDocuments
No documents