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6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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BESI / ESEC 2009 SSIE
    Description
    Solder DB Develop system Solder DB Module SST Motor_714.0320 BT
    Configuration
    No Configuration
    OEM Model Description
    The ESEC 2009 SSIE is an advanced die bonder specifically designed to address the evolving demands of power die attach. Its exceptional productivity and precise process control set new industry standards. Utilizing patented soft solder process technologies, this die bonder ensures optimal results and helps maintain a leading market position. An outstanding feature of the ESEC 2009 SSIE is its capability to handle 300mm / 12" wafers, providing versatility and scalability for various applications.
    Documents

    No documents

    BESI / ESEC

    2009 SSIE

    verified-listing-icon

    Verified

    CATEGORY
    Die Bonders / Sorters / Attachers

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    112234


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    BESI / ESEC 2009 SSIE

    BESI / ESEC

    2009 SSIE

    Die Bonders / Sorters / Attachers
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    BESI / ESEC

    2009 SSIE

    verified-listing-icon
    Verified
    CATEGORY
    Die Bonders / Sorters / Attachers
    Last Verified: Over 60 days ago
    listing-photo-cacf8b4794124fcb85cbdf077dff6aac-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    112234


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Solder DB Develop system Solder DB Module SST Motor_714.0320 BT
    Configuration
    No Configuration
    OEM Model Description
    The ESEC 2009 SSIE is an advanced die bonder specifically designed to address the evolving demands of power die attach. Its exceptional productivity and precise process control set new industry standards. Utilizing patented soft solder process technologies, this die bonder ensures optimal results and helps maintain a leading market position. An outstanding feature of the ESEC 2009 SSIE is its capability to handle 300mm / 12" wafers, providing versatility and scalability for various applications.
    Documents

    No documents

    Similar Listings
    View All
    BESI / ESEC 2009 SSIE

    BESI / ESEC

    2009 SSIE

    Die Bonders / Sorters / AttachersVintage: 0Condition: UsedLast Verified:Over 60 days ago