Description
Esec Soft Solder > Not Installed Top Stock Module for LF handling but still included > with workholder for OMP1 > lacking 2 Monitors > with machine safety coverConfiguration
No ConfigurationOEM Model Description
The ESEC 2009 SSIE is an advanced die bonder specifically designed to address the evolving demands of power die attach. Its exceptional productivity and precise process control set new industry standards. Utilizing patented soft solder process technologies, this die bonder ensures optimal results and helps maintain a leading market position. An outstanding feature of the ESEC 2009 SSIE is its capability to handle 300mm / 12" wafers, providing versatility and scalability for various applications.Documents
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Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: 20 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
123087
Wafer Sizes:
Unknown
Vintage:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BESI / ESEC
2009 SSIE
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: 20 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
123087
Wafer Sizes:
Unknown
Vintage:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Esec Soft Solder > Not Installed Top Stock Module for LF handling but still included > with workholder for OMP1 > lacking 2 Monitors > with machine safety coverConfiguration
No ConfigurationOEM Model Description
The ESEC 2009 SSIE is an advanced die bonder specifically designed to address the evolving demands of power die attach. Its exceptional productivity and precise process control set new industry standards. Utilizing patented soft solder process technologies, this die bonder ensures optimal results and helps maintain a leading market position. An outstanding feature of the ESEC 2009 SSIE is its capability to handle 300mm / 12" wafers, providing versatility and scalability for various applications.Documents
No documents