Description
DIE BOND (DIE BOND ESEC 2007HS)Configuration
DIE BONDOEM Model Description
ESEC 2007 HS is a die attacher manufactured by ESEC. Die attach, also known as die mount or die bond, is the process of attaching a silicon chip to the die pad or die cavity of the support structure (e.g., the leadframe) of a semiconductor package. There are two common die attach processes: adhesive die attach and eutectic die attach. Both of these processes use special die attach equipment and tools to mount the die.Documents
No documents
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: 16 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
138406
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2007 HS
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: 16 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
138406
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
DIE BOND (DIE BOND ESEC 2007HS)Configuration
DIE BONDOEM Model Description
ESEC 2007 HS is a die attacher manufactured by ESEC. Die attach, also known as die mount or die bond, is the process of attaching a silicon chip to the die pad or die cavity of the support structure (e.g., the leadframe) of a semiconductor package. There are two common die attach processes: adhesive die attach and eutectic die attach. Both of these processes use special die attach equipment and tools to mount the die.Documents
No documents