Overview

The NSX® 220 System is an automated macro defect inspection system designed for semiconductor, LED, and MEMS manufacturers. It offers cost-effective back-end macro defect inspection for wafers up to 300mm in size. The system uses gray-scale image analysis to provide fast, accurate inspection and metrology. It can detect traditional advanced macro defects and perform two-dimensional measurements on bumps, probe marks, and edge trim processes. The system features a flexible objective turret, a programmable light tower, a standard docking module, recipe sharing, and a 2D defect and metrology verification standard. It is ideal for manufacturers looking to optimize productivity and minimize the need for operator assistance.