Overview

The 392x Series broadband plasma defect inspection systems support wafer-level defect discovery, yield learning and inline monitoring for ≤7nm logic and leading-edge memory design nodes. With light source technology that produces super resolution deep ultraviolet (SR-DUV) wavelength bands and sensor innovations, the 3920 and 3925 provide high sensitivity capture of unique defect types. The 392x Series also leverages advanced design-aware algorithms, pixel•point™ and nano•cell™, to capture and bin defects in yield-critical pattern locations. With throughput that supports inline monitoring requirements, the 392x Series pairs sensitivity with speed, enabling Discovery at the Speed of Light™, for reduction of the time required to deliver wafer-level data for complete characterization of process issues during development and high volume manufacturing.