Overview

The KLA / TENCOR 2365 is a high resolution imaging system that can be used in 200mm and 300mm fabs. Applications include ritical etch, critical CMP, photo, and engineering analysis. It is particularly ideal for EOL metal etch and copper CMP layers. The KLA/TENCOR 2365 prober uses UV and visible light source and 0.12-mm pixel size for improved inspection sensitivity for 65-nm node and below design rules. In 2004, KLA introduced our latest generation ultraviolet (“UV”)-based high-resolution imaging inspection system, the 2365, which incorporates multiple-bandwidth brightfield illumination and other enhancements to extend the performance of the 2xxx series to the 90-nm node and below.